Low-temperature direct copper-to-copper bonding enabled by creep on highly (1 1 1)-oriented Cu surfaces

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Chien-Min Liu
  • Han-Wen Lin
  • Yi-Cheng Chu
  • Chih Chen
  • Dian-Rong Lyu
  • Kuan-Neng Chen

Detail(s)

Original languageEnglish
Pages (from-to)65-68
Journal / PublicationScripta Materialia
Volume78-79
Publication statusPublished - May 2014
Externally publishedYes

Abstract

We achieve low-temperature Cu-to-Cu direct bonding using highly (1 1 1)-orientated Cu films. The bonding temperature can be lowered to 200 C at a stress of 114 psi for 30 min at 10-3 torr. The temperature is lower than the reflow temperature of 250 C for Pb-free solders. Our breakthrough is based on the finding that the Cu (1 1 1) surface diffusivity is the fastest among all the planes of Cu and the bonding process can occur through surface diffusion creep on the (1 1 1) surfaces. © 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Research Area(s)

  • Creep, Cu-to-Cu direct bonding, Diffusion, Preferred orientation

Bibliographic Note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to lbscholars@cityu.edu.hk.

Citation Format(s)

Low-temperature direct copper-to-copper bonding enabled by creep on highly (1 1 1)-oriented Cu surfaces. / Liu, Chien-Min; Lin, Han-Wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.

In: Scripta Materialia, Vol. 78-79, 05.2014, p. 65-68.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review