TY - GEN
T1 - Low temperature Cu-Cu direct bonding by (111) oriented nano-twin Cu
AU - Juang, Jing-Ye
AU - Chu, Yi-Cheng
AU - Lu, Chia-Ling
AU - Chen, Chih
AU - Tu, King-Ning
PY - 2017
Y1 - 2017
N2 - In this study, a low temperature solid state diffusion bonding process with (111) highly oriented nano-twined Cu (nt-Cu) was proposed. A less void bonding interface was observed reveals a good bonding quality for the bonded samples. In addition, a large quasi-single grain was identified in the bondedfilm. Based on these results, it is believed that high strength and durable bonding structure can be accomplished by bonding two highly (111)-oriented nt-Cu films.
AB - In this study, a low temperature solid state diffusion bonding process with (111) highly oriented nano-twined Cu (nt-Cu) was proposed. A less void bonding interface was observed reveals a good bonding quality for the bonded samples. In addition, a large quasi-single grain was identified in the bondedfilm. Based on these results, it is believed that high strength and durable bonding structure can be accomplished by bonding two highly (111)-oriented nt-Cu films.
UR - https://www.scopus.com/pages/publications/85022186297
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85022186297&origin=recordpage
U2 - 10.23919/LTB-3D.2017.7947428
DO - 10.23919/LTB-3D.2017.7947428
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 978-1-5386-1598-0
T3 - Proceedings of International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D
SP - 32
BT - Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
PB - IEEE
T2 - 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2017)
Y2 - 16 May 2017 through 18 May 2017
ER -