TY - GEN
T1 - Lorentz Force Magnetic Sensor based on a Thin-Film Piezoelectric-on-Silicon Laterally Vibrating Micromechanical Resonator
AU - Ghosh, S.
AU - Lee, J. E Y
PY - 2016/9
Y1 - 2016/9
N2 - We present a unique MEMS magnetometer based on a laterally-vibrating Thin-film Piezoelectric-on-Silicon (TPoS) resonator. This is the first time that the piezoelectric effect has been explored for the detection of magnetic fields among CMOS-compatible resonant devices. Strong electromechanical coupling provided by the Aluminium Nitride (AlN) layer, enhances sensitivity to allow operation in air as opposed to vacuum. A Lorentz force in the presence of a magnetic field excites the in-plane vibration mode. No amplifier circuit has been used at the output of the magnetometer. Our proof-of-concept device has been operated at a resonant frequency of 33.27 MHz, and shows a measured sensitivity of 0.42 μA/T despite a sub-optimal quality factor (Q) of 432 in air.
AB - We present a unique MEMS magnetometer based on a laterally-vibrating Thin-film Piezoelectric-on-Silicon (TPoS) resonator. This is the first time that the piezoelectric effect has been explored for the detection of magnetic fields among CMOS-compatible resonant devices. Strong electromechanical coupling provided by the Aluminium Nitride (AlN) layer, enhances sensitivity to allow operation in air as opposed to vacuum. A Lorentz force in the presence of a magnetic field excites the in-plane vibration mode. No amplifier circuit has been used at the output of the magnetometer. Our proof-of-concept device has been operated at a resonant frequency of 33.27 MHz, and shows a measured sensitivity of 0.42 μA/T despite a sub-optimal quality factor (Q) of 432 in air.
KW - lateral vibration mode
KW - microelectromechanical systems (MEMS)
KW - micromachined resonant magnetic field sensor
KW - Thin-Film Piezoelectric-on-Silicon (TPoS)
UR - https://www.scopus.com/pages/publications/85009962800
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85009962800&origin=recordpage
U2 - 10.1016/j.proeng.2016.11.239
DO - 10.1016/j.proeng.2016.11.239
M3 - RGC 32 - Refereed conference paper (with host publication)
VL - 168
SP - 654
EP - 657
BT - Procedia Engineering
PB - Elsevier Ltd.
T2 - 30th Eurosensors Conference, Eurosensors 2016
Y2 - 4 September 2016 through 7 September 2016
ER -