Local thermal property analysis by scanning thermal microscopy of an ultrafine-grained copper surface layer produced by surface mechanical attrition treatment

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

4 Scopus Citations
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Author(s)

  • F. A. Guo
  • Y. L. JI
  • N. Trannoy
  • J. Lu

Detail(s)

Original languageEnglish
Pages (from-to)24-30
Journal / PublicationMaterials Science and Engineering B: Solid-State Materials for Advanced Technology
Volume130
Issue number1-3
Publication statusPublished - 15 Jun 2006
Externally publishedYes

Abstract

Scanning thermal microscopy (SThM) was used to map thermal conductivity images in an ultrafine-grained copper surface layer produced by surface mechanical attrition treatment (SMAT). It is found that the deformed surface layer shows different thermal conductivities that strongly depend on the grain size of the microstructure: the thermal conductivity of the nanostructured surface layer decreases obviously when compared with that of the coarse-grained matrix of the sample. The role of the grain boundaries in thermal conduction is analyzed in correlation with the heat conduction mechanism in pure metal. A theoretical approach, based on this investigation, was used to calculate the heat flow from the probe tip to the sample and then estimate the thermal conductivities at different scanning positions. Experimental results and theoretical calculation demonstrate that SThM can be used as a tool for the thermal property and microstructural analysis of ultrafine-grained microstructures. © 2006 Elsevier B.V. All rights reserved.

Research Area(s)

  • Copper, SMAT, SThM, Thermal conductivity, Ultrafine-grained microstructure

Citation Format(s)

Local thermal property analysis by scanning thermal microscopy of an ultrafine-grained copper surface layer produced by surface mechanical attrition treatment. / Guo, F. A.; JI, Y. L.; Trannoy, N. et al.
In: Materials Science and Engineering B: Solid-State Materials for Advanced Technology, Vol. 130, No. 1-3, 15.06.2006, p. 24-30.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review