Liquid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate

Xiaoying Liu; Yanhui Zhao; Mingliang Huang; C. M L Wu; Lai Wang

doi:10.1109/ICEPT.2009.5270662

Liquid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate

Xiaoying Liu
, Yanhui Zhao
, Mingliang Huang
, C. M L Wu
, Lai Wang^*

^*Corresponding author for this work

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

6 Citations (Scopus)

Abstract

Growth kinetics and interfacial morphologies of the intermetallic compound (IMCs) between Sn-3Ag-0.5CuxFe( 0, 0.5wt.%, 1wt.%) composite solders and Cu substrates were investigated by reflowing for different durations at 250°C. Fe particles were deposited quickly in the vicinity of IMCs of the as-reflow samples due to the higher density of Fe than that of Sn-Ag-Cu. They formed a region about 30μm wide where the volume percentage of Fe particles could reach 19%. The isothermal equation of chemical reaction and phase diagrams is used to explain the effect of Fe on the growth kinetics of IMCs under liquid-state conditions. It is found that Fe can effectively retard the growth of Cu₆Sn₅ and Cu₃Sn during liquid-state aging and reduce the size of Cu₆Sn₅ particles. Some local small cracks were observed in the Cu₆Sn₅ particles near interfaces of SAC solder alloys after reflowing for about five minutes. Such cracks were found in the other composite solders only thirty minutes reflow. ©2009 IEEE.

Original language	English
Title of host publication	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Pages	687-690
DOIs	https://doi.org/10.1109/ICEPT.2009.5270662
Publication status	Published - 2009
Event	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 - Beijing, China Duration: 10 Aug 2009 → 13 Aug 2009

Conference

Conference	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Place	China
City	Beijing
Period	10/08/09 → 13/08/09

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@inproceedings{90671f412e084319bcbca1d52898c9a9,

title = "Liquid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate",

abstract = "Growth kinetics and interfacial morphologies of the intermetallic compound (IMCs) between Sn-3Ag-0.5CuxFe( 0, 0.5wt.\%, 1wt.\%) composite solders and Cu substrates were investigated by reflowing for different durations at 250°C. Fe particles were deposited quickly in the vicinity of IMCs of the as-reflow samples due to the higher density of Fe than that of Sn-Ag-Cu. They formed a region about 30μm wide where the volume percentage of Fe particles could reach 19\%. The isothermal equation of chemical reaction and phase diagrams is used to explain the effect of Fe on the growth kinetics of IMCs under liquid-state conditions. It is found that Fe can effectively retard the growth of Cu6Sn5 and Cu3Sn during liquid-state aging and reduce the size of Cu6Sn5 particles. Some local small cracks were observed in the Cu6Sn5 particles near interfaces of SAC solder alloys after reflowing for about five minutes. Such cracks were found in the other composite solders only thirty minutes reflow. {\textcopyright}2009 IEEE.",

author = "Xiaoying Liu and Yanhui Zhao and Mingliang Huang and Wu, \{C. M L\} and Lai Wang",

year = "2009",

doi = "10.1109/ICEPT.2009.5270662",

language = "English",

isbn = "9781424446599",

pages = "687--690",

booktitle = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009",

note = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 ; Conference date: 10-08-2009 Through 13-08-2009",

}

Liu, X, Zhao, Y, Huang, M, Wu, CML & Wang, L 2009, Liquid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate. in 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009., 5270662, pp. 687-690, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, Beijing, China, 10/08/09. https://doi.org/10.1109/ICEPT.2009.5270662

Liquid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate. / Liu, Xiaoying; Zhao, Yanhui; Huang, Mingliang et al.
2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. 2009. p. 687-690 5270662.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Liquid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate

AU - Liu, Xiaoying

AU - Zhao, Yanhui

AU - Huang, Mingliang

AU - Wu, C. M L

AU - Wang, Lai

PY - 2009

Y1 - 2009

N2 - Growth kinetics and interfacial morphologies of the intermetallic compound (IMCs) between Sn-3Ag-0.5CuxFe( 0, 0.5wt.%, 1wt.%) composite solders and Cu substrates were investigated by reflowing for different durations at 250°C. Fe particles were deposited quickly in the vicinity of IMCs of the as-reflow samples due to the higher density of Fe than that of Sn-Ag-Cu. They formed a region about 30μm wide where the volume percentage of Fe particles could reach 19%. The isothermal equation of chemical reaction and phase diagrams is used to explain the effect of Fe on the growth kinetics of IMCs under liquid-state conditions. It is found that Fe can effectively retard the growth of Cu6Sn5 and Cu3Sn during liquid-state aging and reduce the size of Cu6Sn5 particles. Some local small cracks were observed in the Cu6Sn5 particles near interfaces of SAC solder alloys after reflowing for about five minutes. Such cracks were found in the other composite solders only thirty minutes reflow. ©2009 IEEE.

AB - Growth kinetics and interfacial morphologies of the intermetallic compound (IMCs) between Sn-3Ag-0.5CuxFe( 0, 0.5wt.%, 1wt.%) composite solders and Cu substrates were investigated by reflowing for different durations at 250°C. Fe particles were deposited quickly in the vicinity of IMCs of the as-reflow samples due to the higher density of Fe than that of Sn-Ag-Cu. They formed a region about 30μm wide where the volume percentage of Fe particles could reach 19%. The isothermal equation of chemical reaction and phase diagrams is used to explain the effect of Fe on the growth kinetics of IMCs under liquid-state conditions. It is found that Fe can effectively retard the growth of Cu6Sn5 and Cu3Sn during liquid-state aging and reduce the size of Cu6Sn5 particles. Some local small cracks were observed in the Cu6Sn5 particles near interfaces of SAC solder alloys after reflowing for about five minutes. Such cracks were found in the other composite solders only thirty minutes reflow. ©2009 IEEE.

UR - https://www.scopus.com/pages/publications/70449941563

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-70449941563&origin=recordpage

U2 - 10.1109/ICEPT.2009.5270662

DO - 10.1109/ICEPT.2009.5270662

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 9781424446599

SP - 687

EP - 690

BT - 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

T2 - 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Y2 - 10 August 2009 through 13 August 2009

ER -

Liquid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate

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