Liquid crystal polymer (LCP) for characterization of millimerwave transmission lines and bandpass filters

H. J. Lu, K. Faeyz, J. Wei, Y. X. Guo, C. K. Cheng

Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review

2 Citations (Scopus)

Abstract

In this paper, a multi-layer LCP substrate fabrication process was described and millimeter wave transmission lines and filters were designed and fabricated on the LCP substrate. Various transitions from a CPW to a microstrip line with their characteristic impedance being 50 ohms were investigated. The characteristics of the wirebonding assembly for connecting two transmission lines was also examined. The measurement results show that an insertion loss of 1.3 dB at 60 GHz can be achieved for the two-wire bonding trasmisssion line including two transitions from a CPW to a microstrip line. Copyright © 2010 by ASME.
Original languageEnglish
Title of host publicationProceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009
PublisherAmerican Society of Mechanical Engineers
Pages153-157
Volume5
ISBN (Print)9780791843789
DOIs
Publication statusPublished - 2010
Externally publishedYes
Event2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009 - Lake Buena Vista, FL, United States
Duration: 13 Nov 200919 Nov 2009

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings
Volume5

Conference

Conference2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009
PlaceUnited States
CityLake Buena Vista, FL
Period13/11/0919/11/09

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