Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying

M. L. Huang; C. M L Wu; J. K L Lai; L. Wang; F. G. Wang

doi:10.1023/A:1008908321027

Author(s)

M. L. Huang
C. M L Wu
J. K L Lai
L. Wang
F. G. Wang

Detail(s)

Original language	English
Pages (from-to)	57-65
Journal / Publication	Journal of Materials Science: Materials in Electronics
Volume	11
Issue number	1
Publication status	Published - 2000

Link(s)

DOI	DOI https://doi.org/10.1023/A:1008908321027 Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-0033882251&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(2c176533-ecce-4553-97a5-665bc30bed0f).html

Abstract

The mechanical alloying (MA) processes of tin-9zinc (Sn-9Zn) and tin-5antimony (Sn-5Sb) were analyzed using an X-ray diffractometer, a differential scanning calorimeter (DSC) and a scanning electron microscope (SEM). The results showed that supersaturated solid solution and intermetallic compound were produced during the MA process. The size of powder particles could be controlled under the proper MA conditions and was reduced to 5 to 20 μm. As a surfactant, proper addition of rosin allows MA to occur smoothly. However, it may also be a source of contamination of the metallic powder. It is considered that MA may be a technique analogous to casting to prepare solder alloys.

Citation Format(s)

[ RIS ] [ BibTeX ]

Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying. / Huang, M. L.; Wu, C. M L ; Lai, J. K L et al.
In: Journal of Materials Science: Materials in Electronics, Vol. 11, No. 1, 2000, p. 57-65.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Huang, ML, Wu, CML , Lai, JKL, Wang, L & Wang, FG 2000, 'Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying', Journal of Materials Science: Materials in Electronics, vol. 11, no. 1, pp. 57-65. https://doi.org/10.1023/A:1008908321027

Huang, M. L., Wu, C. M. L., Lai, J. K. L., Wang, L., & Wang, F. G. (2000). Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying. Journal of Materials Science: Materials in Electronics, 11(1), 57-65. https://doi.org/10.1023/A:1008908321027

Huang ML, Wu CML , Lai JKL, Wang L, Wang FG. Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying. Journal of Materials Science: Materials in Electronics. 2000;11(1):57-65. doi: 10.1023/A:1008908321027

Huang, M. L. ; Wu, C. M L ; Lai, J. K L et al. / Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying. In: Journal of Materials Science: Materials in Electronics. 2000 ; Vol. 11, No. 1. pp. 57-65.