TY - JOUR
T1 - Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying
AU - Huang, M. L.
AU - Wu, C. M L
AU - Lai, J. K L
AU - Wang, L.
AU - Wang, F. G.
PY - 2000
Y1 - 2000
N2 - The mechanical alloying (MA) processes of tin-9zinc (Sn-9Zn) and tin-5antimony (Sn-5Sb) were analyzed using an X-ray diffractometer, a differential scanning calorimeter (DSC) and a scanning electron microscope (SEM). The results showed that supersaturated solid solution and intermetallic compound were produced during the MA process. The size of powder particles could be controlled under the proper MA conditions and was reduced to 5 to 20 μm. As a surfactant, proper addition of rosin allows MA to occur smoothly. However, it may also be a source of contamination of the metallic powder. It is considered that MA may be a technique analogous to casting to prepare solder alloys.
AB - The mechanical alloying (MA) processes of tin-9zinc (Sn-9Zn) and tin-5antimony (Sn-5Sb) were analyzed using an X-ray diffractometer, a differential scanning calorimeter (DSC) and a scanning electron microscope (SEM). The results showed that supersaturated solid solution and intermetallic compound were produced during the MA process. The size of powder particles could be controlled under the proper MA conditions and was reduced to 5 to 20 μm. As a surfactant, proper addition of rosin allows MA to occur smoothly. However, it may also be a source of contamination of the metallic powder. It is considered that MA may be a technique analogous to casting to prepare solder alloys.
UR - http://www.scopus.com/inward/record.url?scp=0033882251&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0033882251&origin=recordpage
U2 - 10.1023/A:1008908321027
DO - 10.1023/A:1008908321027
M3 - RGC 21 - Publication in refereed journal
SN - 0957-4522
VL - 11
SP - 57
EP - 65
JO - Journal of Materials Science: Materials in Electronics
JF - Journal of Materials Science: Materials in Electronics
IS - 1
ER -