Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
- Kejun Zeng
- , Roger Stierman
- , Tz-Cheng Chiu
- , Darvin Edwards
- , Kazuaki Ano
- , K. N. Tu
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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