Irradiation induced void spheroidization, shrinkage and migration in Cu at elevated temperatures : An in situ study

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

9 Scopus Citations
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Author(s)

  • Rayaprolu Goutham Sreekar Annadanam
  • Zhongxia Shang
  • Jin Li
  • Meimei Li
  • Haiyan Wang
  • Anter El-Azab
  • Xinghang Zhang

Detail(s)

Original languageEnglish
Pages (from-to)504-516
Journal / PublicationActa Materialia
Volume201
Online published7 Oct 2020
Publication statusPublished - Dec 2020
Externally publishedYes

Abstract

Understanding the void evolution in irradiation environment is of great interest and significance, as irradiation-induced voids typically lead to pronounced volumetric swelling and degradation of mechanical properties. In situ studies on the irradiation response of nanovoids at elevated temperature remain limited. In this work, we performed systematic in situ 1 MeV Kr++ irradiations on Cu with nanovoids in a transmission electron microscope up to 350 °C. The in situ studies revealed intriguing void spheroidization, shrinkage and migration. Furthermore, the morphology evolution and migration of nanovoids showed a strong dependence on irradiation temperature and initial void size. Post-irradiation analyses identified defect clusters in the form of stacking fault tetrahedrons, and the remaining large faceted nanovoids. The underlying mechanisms of irradiation-induced void spheroidization and shrinkage were discussed based on phase-field modeling.

Research Area(s)

  • In situ irradiation, Phase-field modeling, Spheroidization, Stacking fault tetrahedron, Void migration

Citation Format(s)

Irradiation induced void spheroidization, shrinkage and migration in Cu at elevated temperatures: An in situ study. / Fan, Cuncai; Annadanam, Rayaprolu Goutham Sreekar; Shang, Zhongxia et al.
In: Acta Materialia, Vol. 201, 12.2020, p. 504-516.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review