Abstract
Ion focusing in enhanced glow discharge plasma immersion ion implantation (EGD-PIII) of hydrogen into silicon affects the lateral ion fluence uniformity. The phenomenon and its effects are investigated experimentally and theoretically under different conditions and compared to those in nitrogen EGD-PIII. Consistent results are obtained from experiments and numerical simulation disclosing that the lower the plasma density, the more severe is the ion focusing effect. The influence of the negative high voltage on the ion focusing effect is small compared to that of the plasma density. © 2010 American Institute of Physics.
Original language | English |
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Article number | 33304 |
Journal | Journal of Applied Physics |
Volume | 108 |
Issue number | 3 |
DOIs | |
Publication status | Published - 1 Aug 2010 |