Investigation of Scaling Effect of Copper Microwire based on in-situ Nanorobotic Twisting inside SEM

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)

View graph of relations

Author(s)

Detail(s)

Original languageEnglish
Title of host publication2018 IEEE International Conference on Robotics and Automation (ICRA)
PublisherIEEE
Pages3461-3466
ISBN (Electronic)978-1-5386-3081-5
Publication statusPublished - May 2018

Publication series

NameProceedings - IEEE International Conference on Robotics and Automation
PublisherIEEE
ISSN (Print)1050-4729
ISSN (Electronic)2577-087X

Conference

Title2018 IEEE International Conference on Robotics and Automation (ICRA 2018)
PlaceAustralia
CityBrisbane
Period21 - 25 May 2018

Abstract

Copper microwire is an essential metal widely used in micro-electron mechanical systems. Since micro/nano material usually demonstrates unique mechanical properties due to scaling effect, copper microwire mechanical properties need to be investigated for better adhibition. Herein, we propose a nanorobotics manipulation system for copper microwire in-situ twisting test. Firstly, a system with six degree-of-freedoms (DOFs) nanorobotic manipulator integrated inside scanning electron microscope (SEM) is introduced. Secondly, a positioning and assembly method for copper microwire specimen are proposed to solve the mismatching problem. Finally, the copper microwire is twisted in-situ and its properties are investigated and analyzed. The copper microwire sample fracture morphology shows a severe plastic deformation and being along with the emergence of deformation twin and intertwine, which exhibit strong scaling effects. This system provides a new method for in-situ twisting test, which paves the way for mechanical characterization inside SEM and benefits the fundamental nanomaterial research immensely.

Research Area(s)

  • COMPRESSION, SIZE, PLASTICITY, MICROSCOPY, NANOWIRES, EVOLUTION, BEHAVIOR, DRIVEN, GROWTH

Citation Format(s)

Investigation of Scaling Effect of Copper Microwire based on in-situ Nanorobotic Twisting inside SEM. / Lu, Haojian; Xue, Fengmei; Wan, Wenfeng; Shen, Yajing.

2018 IEEE International Conference on Robotics and Automation (ICRA). IEEE, 2018. p. 3461-3466 8460573 (Proceedings - IEEE International Conference on Robotics and Automation).

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)