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Investigation of grain growth mechanisms in nanocrystalline Cu for Cu direct bonding

Shichen Xie, Ziting Ye, Zishan Xiong, Fuxin Du, Songpeng Zhao, K.N. Tu, Yuzheng Guo, Sheng Liu, Yingxia Liu*

*Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

35 Downloads (CityUHK Scholars)
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