Investigation in microstructure and mechanical properties of Ni-coated multi-wall carbon nanotubes doped Sn3.0Ag0.5Cu solder alloys

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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Detail(s)

Original languageEnglish
Title of host publicationElectronic System-Integration Technology Conference (ESTC), 2016 6th
PublisherIEEE
ISBN (Print)9781509014026
Publication statusPublished - Sep 2016

Conference

Title6th Electronic System-Integration Technology Conference, ESTC 2016
PlaceFrance
CityGrenoble
Period13 - 16 September 2016

Abstract

Reinforcement materials such as carbon nanotubes (CNTs), have been demonstrated to be beneficial in improving composite-solder reliability through their super electrical, mechanical and thermal properties. However, interfacial interaction weakness still exists between CNTs and solder alloys. In this study, we managed to incorporate nickel-coated multi-walled carbon nanotubes (Ni-CNTs) into Sn3.0Ag0.5Cu solder matrix with various weight percentages of 0.01 wt%, 0.05 wt%, and 0.1 wt%. Microstructures, intermetallic compound (IMC) layers, mechanical properties including micro-hardness and shear testing, have been implemented to investigate the solderability of composite solders with the utilization of scanning electron microscope and energy dispersive X-ray spectrometer analysis. In comparison with Ni-CNT doping method, CNT doping is easily getting saturated and hereafter arduously to be incorporated due to their physical and chemical limitations. With 0.05 wt% doping Ni-CNTs, fine Ag3Sn strips and scallop-shaped (Cu, Ni)6Sn5 IMC layer are formed at the solder-subtract interface, resulting in the maximum improvement of 24.3% and 14.9% in hardness and shear strength, respectively. The existence of micro dopants in the composite solder act as impurity centers and can effectively retard the diffusion of atoms. The increase in strengthening effects in solder joints can be attributed to the combination of (a) impeding effects of uniformly distributed second-phase particles and (b) the consumption of Ni by intermetallic reactions.

Research Area(s)

  • Carbon nanotube, Lead-free solder, Mechanical property, Microstructure

Citation Format(s)

Investigation in microstructure and mechanical properties of Ni-coated multi-wall carbon nanotubes doped Sn3.0Ag0.5Cu solder alloys. / Xiao, Hua; Chan, Yan-Cheong; Zhu, Ze; Wu, Fengshun.

Electronic System-Integration Technology Conference (ESTC), 2016 6th. IEEE, 2016. 7764686.

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review