TY - CHAP
T1 - Introduction
AU - Tu, King-Ning
PY - 2007
Y1 - 2007
N2 - Solder has been used to join copper pipes for plumbing in every modern house and to join copper wires for circuitry connection in every electrical product. Solder joints are ubiquitous. The essential process in solder joining is the chemical reaction between copper and tin to form intermetallic compounds having a strong metallic bonding. After the iron–carbon (Fe-C) binary system, copper–tin (Cu-Sn) may be the second most important metallurgical binary system that has impacted human civilization, as suggested by the bronze (Cu-Sn alloy) age. © 2007 Springer Science+Business Media, LLC
AB - Solder has been used to join copper pipes for plumbing in every modern house and to join copper wires for circuitry connection in every electrical product. Solder joints are ubiquitous. The essential process in solder joining is the chemical reaction between copper and tin to form intermetallic compounds having a strong metallic bonding. After the iron–carbon (Fe-C) binary system, copper–tin (Cu-Sn) may be the second most important metallurgical binary system that has impacted human civilization, as suggested by the bronze (Cu-Sn alloy) age. © 2007 Springer Science+Business Media, LLC
KW - Composite Solder Joint
KW - Molten Solder
KW - Solder Alloy
KW - Solder Ball
KW - Solder Joint
UR - http://www.scopus.com/inward/record.url?scp=85072862547&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85072862547&origin=recordpage
U2 - 10.1007/978-0-387-38892-2_1
DO - 10.1007/978-0-387-38892-2_1
M3 - Foreword/preface/postscript
SN - 978-0-387-38890-8
SN - 978-1-4419-2284-7
T3 - Springer Series in Materials Science
SP - 1
EP - 33
BT - Solder Joint Technology
PB - Springer
CY - New York, NY
ER -