Internal structure refinement of porous sintered silver via electromigration

Ali Mansourian*, Seyed Amir Paknejad, Qiannan Wen, Khalid Khtatba, Anatoly V. Zayats, Samjid H. Mannan

*Corresponding author for this work

    Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review

    Abstract

    Atoms can move under high stress conditions such as temperature, mechanical pressure or electric current. Electromigration provides a driving force to move the atoms in metals conducting current usually resulting in the accumulation of atoms and void formation in anode and cathode respectively. The electromigration effect is normally considered a serious problem for electronic circuits but the recent works1-7 show that it can be used constructively for controlled fabrication of nanostructures2-4.We demonstrate that electromigration can be utilized to refine the porous structure of a sintered silver stripe leading to transformation of the internal pore and grain structure. The results show that pore shape, size and distribution are significantly changed after electromigration. Similarly, we have used the electromigration effect to mass produce nanorods under current densities of the order of 2.4 ×10+8 A/m2. Nanorods were formed across the whole stripe contrasting with studies on non-porous substrates which show nanorod production at the anode only. The results show the internal pore structure can be transformed and refined by electromigration. The results also suggest that by controlling current densities in a porous substrate, complex patterns of porous structures and high-quality single crystal nanorods can be formed insitu with significant advantages over competing methods of nanorod formation for sensor applications.
    Original languageEnglish
    Title of host publicationAdditional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
    PublisherInternational Microelectronics Assembly and Packaging Society
    Pages000190-000195
    Volume2016 (Issue HiTEC)
    ISBN (Electronic)2380-4491
    DOIs
    Publication statusPublished - May 2016
    EventInternational Conference on High Temperature Electronics (HiTEC 2016) - Albuquerque, United States
    Duration: 10 May 201612 May 2016
    http://www.imaps.org/hitec/exhibits2016.htm

    Conference

    ConferenceInternational Conference on High Temperature Electronics (HiTEC 2016)
    Abbreviated titleHiTEC 2016
    PlaceUnited States
    CityAlbuquerque
    Period10/05/1612/05/16
    Internet address

    Research Keywords

    • Electromigration
    • Internal structure refinement
    • Nanorod
    • Porous sintered silver

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