Interfacial-shear strength of the perfluorocyclobutane films on silicon

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)1759-1769
Journal / PublicationJournal of Materials Research
Volume21
Issue number7
Publication statusPublished - Jul 2006
Externally publishedYes

Abstract

The debonding behavior of perfluorocyclobutane (PFCB) films on silicon (Si) has been investigated using Vickers indentation as a function of cure temperature and film thickness. PFCB films on Si were processed by spin coating (1-4 μm) and solution casting (20-60 μm). The interfacial shear strength of solution-cast PFCB films was independent of film thickness. The interfacial shear strength increased with cure temperature. The PFCB/Si cured at 225 °C exhibited interfacial shear strength of 123 MPa, and the strength increased to 163 MPa when the cure temperature was raised to 275 °C. The increase in interfacial-shear strength with temperature has been attributed to the increase in the density of bonds between PFCB and Si due to an increase in the density of crosslinks. Spin-coated films exhibited cracking due to the penetration of the indenter into the substrate, and the extent of cracking increased with the load. © 2006 Materials Research Society.

Citation Format(s)

Interfacial-shear strength of the perfluorocyclobutane films on silicon. / Boddapati, Srinivasa Rao; Ma, Hong; Bordia, Rajendra K. et al.
In: Journal of Materials Research, Vol. 21, No. 7, 07.2006, p. 1759-1769.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review