Abstract
Lead-free solders with high Sn content cause excessive interfacial reactions at the interface with under-bump metallization during reflow. The interface formed after reflow affects the reliability of the solder joint. For this paper, we investigated the interfacial reactions of Sn0.7Cu and Sn36Pb2Ag solder on electrolytic Ni layer for different reflow times. The traditionally used Sn36Pb2Ag solder was used as a reference. It was found that during as-reflowed, the formation of Cu-rich Sn-Cu-Ni ternary intermetallic compounds (TIMCs) at the interface of Sn0.7Cu solder with electrolytic Ni is much quicker, resulting in the entrapment of some Pb (which is present as impurity in the Sn-Cu solder) rich phase in the TIMCs. During extended time of reflow, high (>30 at.%), medium (30-15 at.%) and low (
| Original language | English |
|---|---|
| Pages (from-to) | 2897-2904 |
| Journal | Journal of Materials Research |
| Volume | 19 |
| Issue number | 10 |
| DOIs | |
| Publication status | Published - Oct 2004 |
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