Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Related Research Unit(s)
Detail(s)
| Original language | English |
|---|---|
| Pages (from-to) | 662-669 |
| Journal / Publication | Journal of Electronic Materials |
| Volume | 34 |
| Issue number | 5 |
| Publication status | Published - May 2005 |
Link(s)
Abstract
Cu-containing solder alloys have been used to identify their interfacial reactions with electroless NiP. As-reflowed, AuSn4 intermetallic compounds (IMCs) are formed in the Sn-Cu and Sn-Ag-Cu solders, but in the cases of Sn-Ag-Cu-In, In-Sn-Au IMCs are formed and are uniformly distributed in the solder. Different types of IMCs such as high-Cu (>30 at.%), medium-Cu (30-15 at.%), and low-Cu (
Research Area(s)
- Cu-containing solder, Dissolution of electroless NiP, Intermetallics, Lead-free solder
Citation Format(s)
Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization. / Islam, M. N.; Chan, Y. C.
In: Journal of Electronic Materials, Vol. 34, No. 5, 05.2005, p. 662-669.
In: Journal of Electronic Materials, Vol. 34, No. 5, 05.2005, p. 662-669.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
