Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization

M. N. Islam; Y. C. Chan

Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization

M. N. Islam
, Y. C. Chan

Department of Electrical Engineering

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

10 Citations (Scopus)

Abstract

Cu-containing solder alloys have been used to identify their interfacial reactions with electroless NiP. As-reflowed, AuSn₄ intermetallic compounds (IMCs) are formed in the Sn-Cu and Sn-Ag-Cu solders, but in the cases of Sn-Ag-Cu-In, In-Sn-Au IMCs are formed and are uniformly distributed in the solder. Different types of IMCs such as high-Cu (>30 at.%), medium-Cu (30-15 at.%), and low-Cu (

Original language	English
Pages (from-to)	662-669
Journal	Journal of Electronic Materials
Volume	34
Issue number	5
Publication status	Published - May 2005

Research Keywords

Cu-containing solder
Dissolution of electroless NiP
Intermetallics
Lead-free solder

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title = "Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization",

abstract = "Cu-containing solder alloys have been used to identify their interfacial reactions with electroless NiP. As-reflowed, AuSn4 intermetallic compounds (IMCs) are formed in the Sn-Cu and Sn-Ag-Cu solders, but in the cases of Sn-Ag-Cu-In, In-Sn-Au IMCs are formed and are uniformly distributed in the solder. Different types of IMCs such as high-Cu (>30 at.\%), medium-Cu (30-15 at.\%), and low-Cu (",

keywords = "Cu-containing solder, Dissolution of electroless NiP, Intermetallics, Lead-free solder",

author = "Islam, \{M. N.\} and Chan, \{Y. C.\}",

year = "2005",

month = may,

language = "English",

volume = "34",

pages = "662--669",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "5",

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TY - JOUR

T1 - Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization

AU - Islam, M. N.

AU - Chan, Y. C.

PY - 2005/5

Y1 - 2005/5

N2 - Cu-containing solder alloys have been used to identify their interfacial reactions with electroless NiP. As-reflowed, AuSn4 intermetallic compounds (IMCs) are formed in the Sn-Cu and Sn-Ag-Cu solders, but in the cases of Sn-Ag-Cu-In, In-Sn-Au IMCs are formed and are uniformly distributed in the solder. Different types of IMCs such as high-Cu (>30 at.%), medium-Cu (30-15 at.%), and low-Cu (

AB - Cu-containing solder alloys have been used to identify their interfacial reactions with electroless NiP. As-reflowed, AuSn4 intermetallic compounds (IMCs) are formed in the Sn-Cu and Sn-Ag-Cu solders, but in the cases of Sn-Ag-Cu-In, In-Sn-Au IMCs are formed and are uniformly distributed in the solder. Different types of IMCs such as high-Cu (>30 at.%), medium-Cu (30-15 at.%), and low-Cu (

KW - Cu-containing solder

KW - Dissolution of electroless NiP

KW - Intermetallics

KW - Lead-free solder

UR - https://www.scopus.com/pages/publications/20344376668

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-20344376668&origin=recordpage

M3 - RGC 21 - Publication in refereed journal

SN - 0361-5235

VL - 34

SP - 662

EP - 669

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 5

ER -

Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization

Abstract

Research Keywords

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