TY - JOUR
T1 - Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow
AU - Alam, M. O.
AU - Chan, Y. C.
AU - Hung, K. C.
PY - 2002/10
Y1 - 2002/10
N2 - The interfaces between electroless Ni-P deposit and Pb-Sn solder and Sn-Ag solder were formed by reflowing for different time periods to examine their microstructures and microchemistry. It was found that the Pb-Sn solder interface is more stable than the Sn-Ag solder interface. Sn-Ag solder reacts quickly with the electroless Ni-P deposit and forms nonadherent Ni-Sn intermetallic compounds (IMCs). Pb-Sn solder reacts slowly and forms adherent Ni-Sn IMC. A P-rich Ni layer, revealed as a dark layer under scanning electron microscopy (SEM), is formed on the electroless Ni-P deposit due to the solder reaction. For short reflow times, this P-rich Ni layer consists of only Ni3P compound, but during prolonged reflow, new crystals of Ni2P, Ni5P4, and NiP2 are also found to be formed from the amorphous electroless Ni-P layer.
AB - The interfaces between electroless Ni-P deposit and Pb-Sn solder and Sn-Ag solder were formed by reflowing for different time periods to examine their microstructures and microchemistry. It was found that the Pb-Sn solder interface is more stable than the Sn-Ag solder interface. Sn-Ag solder reacts quickly with the electroless Ni-P deposit and forms nonadherent Ni-Sn intermetallic compounds (IMCs). Pb-Sn solder reacts slowly and forms adherent Ni-Sn IMC. A P-rich Ni layer, revealed as a dark layer under scanning electron microscopy (SEM), is formed on the electroless Ni-P deposit due to the solder reaction. For short reflow times, this P-rich Ni layer consists of only Ni3P compound, but during prolonged reflow, new crystals of Ni2P, Ni5P4, and NiP2 are also found to be formed from the amorphous electroless Ni-P layer.
KW - Amorphous
KW - Crystallization
KW - Electroless Ni-P
KW - Intermetallic compound
KW - Reflow
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M3 - RGC 21 - Publication in refereed journal
SN - 0361-5235
VL - 31
SP - 1117
EP - 1121
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 10 SPEC.
ER -