Interfacial reaction behavior of Pt, Pd, and Ni on ZnSe

K. J. Duxstad, E. E. Haller, K. M. Yu, E. D. Bourret, X. W. Lin, S. Ruvimov, Z. Liliental-Weber, J. Washburn

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

6 Citations (Scopus)

Abstract

The solid-state reactions of Pt, Pd, and Ni thin film contacts on ZnSe were studied. Pd has been observed to react at 200 °C to form a ternary, epitaxial phase, Pd5+xZnSe. This phase is stable up to 450 °C, when Pd begins to diffuse through the ZnSe into the GaAs substrate. Pt begins to react at 575 °C and forms a layer of Pt5Se4 at the Pt/ZnSe interface. Above the interfacial layer there is a Pt-Zn solid solution, but no Pt-Zn phases were observed. After annealing at 675 °C, the Pt°Se° phase is no longer observed and Pt-Zn phases form. A small amount of interdiffusion at the Ni/ZnSe interface has been observed by transmission electron microscopy after annealing at 300 °C. Annealing at 425 °C results in the formation of laterally separated grains of a metastable Nix;Se phase. After annealing at 450 °C, grains of NiSe are observed. The similarities between these reactions and the near-noble metal reactions on Si and GaAs are discussed as well as the possibility of using these reactions for forming electrical contacts to ZnSe. © 1997 American Vacuum Society.
Original languageEnglish
Pages (from-to)891-898
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume15
Issue number4
DOIs
Publication statusPublished - Jul 1997
Externally publishedYes

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