Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates
- Tama Fouzder*
- , Y. C. Chan
- , Daniel K. Chan
*Corresponding author for this work
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review