Interfacial Characterizations of a Nickel-Phosphorus Layer Electrolessly Deposited on a Silane Compound-Modified Silicon Wafer Under Thermal Annealing

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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Material Science

100
Silicon Wafer Material Science
100
Characterization Material Science
100
Nickel Material Science
100
Silane Material Science
25
Palladium Material Science
25
Annealing Material Science
25
Nanoclusters Material Science
25
Silicide Material Science
25
Surface (Surface Sc... Material Science
12
Temperature Material Science
12
Scanning Electron M... Material Science
12
Devices Material Science
12
Electrical Resistiv... Material Science
12
Transmission Electr... Material Science
12
Adhesion Material Science
12
Bond Strength (Mate... Material Science
12
Electroless Deposit... Material Science

Keyphrases

100
Silicon Wafer Keyphrases
100
Thermal Annealing Keyphrases
100
Interfacial Charact... Keyphrases
100
Compound Modified Keyphrases
100
Silane Compounds Keyphrases
100
Nickel-phosphorus Keyphrases
28
Annealing Keyphrases
28
Si Surface Keyphrases
28
Si Wafer Keyphrases
28
Ni Layer Keyphrases
28
Polyvinylpyrrolidon... Keyphrases
28
Ni Silicide Keyphrases
28
Palladium Nanoclust... Keyphrases
14
Transmission Electr... Keyphrases
14
Scanning Electron M... Keyphrases
14
Linker Keyphrases
14
Contact Resistivity Keyphrases
14
Device Performance Keyphrases
14
Rapid Thermal Annea... Keyphrases
14
Electron Transmissi... Keyphrases
14
Microstructural Cha... Keyphrases
14
Adhesion Keyphrases
14
Adhesion Strength Keyphrases
14
Atomic Diffusion Keyphrases
14
Silicide Formation Keyphrases
14
Device Reliability Keyphrases
14
X-ray Diffractomete... Keyphrases
14
Electroless Nickel-... Keyphrases
14
Adhesion Contact Keyphrases
14
Resistivity Measure... Keyphrases
14
Covalently Bonded Keyphrases
14
Pd-catalyzed Keyphrases
14
Electroless Deposit... Keyphrases
14
High Annealing Temp... Keyphrases
14
Front Side Metalliz... Keyphrases
14
3-[2-(2-Aminoethyla... Keyphrases

INIS

100
silicon INIS
100
layers INIS
100
annealing INIS
100
phosphorus INIS
100
nickel INIS
100
silanes INIS
25
surfaces INIS
25
nanostructures INIS
25
adhesion INIS
25
palladium INIS
25
silicides INIS
25
polyvinylpyrrolidon... INIS
12
microstructure INIS
12
transmission electr... INIS
12
performance INIS
12
barriers INIS
12
diffusion INIS
12
deposition INIS
12
scanning electron m... INIS
12
devices INIS
12
bridges INIS
12
reliability INIS
12
palladium ions INIS
12
x-ray diffractomete... INIS

Engineering

100
Silicon Wafer Engineering
100
Nanoclusters Engineering
100
Si Wafer Engineering
100
Si Surface Engineering
100
Palladium Engineering
50
Reliability Engineering
50
Annealing Engineering
50
Device Performance Engineering
50
Annealing Temperatu... Engineering
50
Rapid Thermal Annea... Engineering
50
Bridges Engineering
50
Metallizations Engineering
50
Front Side Engineering
50
Electroless Nickel Engineering
50
Measurement Engineering
50
Electroless Plating Engineering
50
Atomic Diffusion Engineering
Research OutputsResearch Output authored by Interfacial Characterizations of a Nickel-Phosphorus Layer Electrolessly Deposited on a Silane Compound-Modified Silicon Wafer Under Thermal Annealing is tagged with the concept