INTERFACE METALLURGY FOR MERCURY CONTACTS.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Journal / Publication | IBM technical disclosure bulletin |
Volume | 25 |
Issue number | 11 A |
Publication status | Published - 1983 |
Externally published | Yes |
Link(s)
Abstract
Mercury contacts for microelectronic connections may yield poor contacts due to the fact that mercury dewets the metal base on which it is located or amalgamates with the metal base within a short time. This reduces the cycle time of the contact, and is especially troublesome in Josephson technology, where extreme temperature cycling occurs. To achieve controlled adhesion of the metal base or circuit wiring by the use of mercury, an interface structure is used between the circuit wiring and base. This interface is comprised of a plurality of layers between the liquid mercury and underlying base.
Bibliographic Note
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Citation Format(s)
INTERFACE METALLURGY FOR MERCURY CONTACTS. / Tu, K. N.; Wu, C. T.
In: IBM technical disclosure bulletin, Vol. 25, No. 11 A, 1983.
In: IBM technical disclosure bulletin, Vol. 25, No. 11 A, 1983.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review