INTERFACE METALLURGY FOR MERCURY CONTACTS.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

View graph of relations

Author(s)

Detail(s)

Original languageEnglish
Journal / PublicationIBM technical disclosure bulletin
Volume25
Issue number11 A
Publication statusPublished - 1983
Externally publishedYes

Abstract

Mercury contacts for microelectronic connections may yield poor contacts due to the fact that mercury dewets the metal base on which it is located or amalgamates with the metal base within a short time. This reduces the cycle time of the contact, and is especially troublesome in Josephson technology, where extreme temperature cycling occurs. To achieve controlled adhesion of the metal base or circuit wiring by the use of mercury, an interface structure is used between the circuit wiring and base. This interface is comprised of a plurality of layers between the liquid mercury and underlying base.

Bibliographic Note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Citation Format(s)

INTERFACE METALLURGY FOR MERCURY CONTACTS. / Tu, K. N.; Wu, C. T.
In: IBM technical disclosure bulletin, Vol. 25, No. 11 A, 1983.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review