Abstract
Ge is a promising candidate to replace Si in future low-power logic applications. However, the unstable germanium oxide formed at the interface between the channel and dielectric layer has impeded the progress of Ge-based nanoelectronics. We discover the insulating fluorinated graphene can be employed as an efficient diffusion barrier layer to suppress the formation of the unstable interfacial oxide in Ge-based devices. The Ge-based device with the fluorinated graphene exhibits negligible capacitance versus voltage hysteresis, extremely low leakage, and superior equivalent oxide thickness.
| Original language | English |
|---|---|
| Title of host publication | 2018 IEEE Electron Devices Technology and Manufacturing Conference (EDTM) - Proceedings |
| Publisher | IEEE |
| Pages | 202-204 |
| ISBN (Electronic) | 9781538637111 |
| ISBN (Print) | 9781538637128 |
| DOIs | |
| Publication status | Published - Mar 2018 |
| Event | 2nd IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018 - Kobe, Japan Duration: 13 Mar 2018 → 16 Mar 2018 |
Conference
| Conference | 2nd IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018 |
|---|---|
| Abbreviated title | EDTM 2018 |
| Place | Japan |
| City | Kobe |
| Period | 13/03/18 → 16/03/18 |
Research Keywords
- Fluorinated graphene
- Germanium
- High-k dielectric
- Metal-Oxide-Semiconductor
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