Interface characterization and mechanical properties of BMG/Cu composites prepared by coextrusion

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Y. Liu
  • J. J. Blandin
  • G. Kapelski
  • M. Suéry
  • X. J. Yang

Detail(s)

Original languageEnglish
Pages (from-to)57-64
Journal / PublicationIntermetallics
Volume30
Publication statusPublished - Nov 2012
Externally publishedYes

Abstract

A BMG/Cu composite rod and a plate with a Cu 40Zr 44Ag 8Al 8 BMG core and a pure copper sleeve have been fabricated by the coextrusion process. The interfaces between the two materials have been analyzed through various techniques including optical microscopy (OM), scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDX) and transmission electron microscopy (TEM). Good interface adhesion with metallurgical bonding has been formed, corresponding to two diffusion layers of about 100 nm near the Cu and BMG parts. An interface bonding model has been constructed based on these observations. The fracture mode of the BMG/Cu composite has been also characterized by compression tests, which involves debonding at the interface and plastic deformation of the Cu sleeve. © 2012 Elsevier Ltd.

Research Area(s)

  • A. Composites, B. Bonding, B. Glasses, metallic, C. Extrusion, D. Phase interfaces

Citation Format(s)

Interface characterization and mechanical properties of BMG/Cu composites prepared by coextrusion. / Liu, Y.; Blandin, J. J.; Kapelski, G.; Suéry, M.; Yang, X. J.

In: Intermetallics, Vol. 30, 11.2012, p. 57-64.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review