Interface characterization and mechanical properties of BMG/Cu composites prepared by coextrusion

Y. Liu; J. J. Blandin; G. Kapelski; M. Suéry; X. J. Yang

doi:10.1016/j.intermet.2012.03.039

Author(s)

Y. Liu
J. J. Blandin
G. Kapelski
M. Suéry
X. J. Yang

Detail(s)

Original language	English
Pages (from-to)	57-64
Journal / Publication	Intermetallics
Volume	30
Publication status	Published - Nov 2012
Externally published	Yes

Link(s)

DOI	DOI https://doi.org/10.1016/j.intermet.2012.03.039 Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-84865646276&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(0d927f4e-daae-4702-afe5-959ba5a41212).html

Abstract

A BMG/Cu composite rod and a plate with a Cu ₄₀Zr ₄₄Ag ₈Al ₈ BMG core and a pure copper sleeve have been fabricated by the coextrusion process. The interfaces between the two materials have been analyzed through various techniques including optical microscopy (OM), scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDX) and transmission electron microscopy (TEM). Good interface adhesion with metallurgical bonding has been formed, corresponding to two diffusion layers of about 100 nm near the Cu and BMG parts. An interface bonding model has been constructed based on these observations. The fracture mode of the BMG/Cu composite has been also characterized by compression tests, which involves debonding at the interface and plastic deformation of the Cu sleeve. © 2012 Elsevier Ltd.

Research Area(s)

A. Composites, B. Bonding, B. Glasses, metallic, C. Extrusion, D. Phase interfaces

Citation Format(s)

[ RIS ] [ BibTeX ]

Interface characterization and mechanical properties of BMG/Cu composites prepared by coextrusion. / Liu, Y.; Blandin, J. J.; Kapelski, G. et al.

In: Intermetallics, Vol. 30, 11.2012, p. 57-64.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

Liu, Y, Blandin, JJ, Kapelski, G, Suéry, M & Yang, XJ 2012, 'Interface characterization and mechanical properties of BMG/Cu composites prepared by coextrusion', Intermetallics, vol. 30, pp. 57-64. https://doi.org/10.1016/j.intermet.2012.03.039

Liu, Y., Blandin, J. J., Kapelski, G., Suéry, M., & Yang, X. J. (2012). Interface characterization and mechanical properties of BMG/Cu composites prepared by coextrusion. Intermetallics, 30, 57-64. https://doi.org/10.1016/j.intermet.2012.03.039

Liu Y, Blandin JJ, Kapelski G, Suéry M, Yang XJ. Interface characterization and mechanical properties of BMG/Cu composites prepared by coextrusion. Intermetallics. 2012 Nov;30:57-64. doi: 10.1016/j.intermet.2012.03.039

Liu, Y. ; Blandin, J. J. ; Kapelski, G. et al. / Interface characterization and mechanical properties of BMG/Cu composites prepared by coextrusion. In: Intermetallics. 2012 ; Vol. 30. pp. 57-64.