Interface analysis of inorganic films on polyimide with atomic oxygen exposure

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Yongxian Huang
  • Shixiong Lv
  • Xiubo Tian
  • Ricky K.Y. Fu
  • Paul K. Chu

Detail(s)

Original languageEnglish
Pages (from-to)121-126
Journal / PublicationSurface and Coatings Technology
Volume216
Publication statusPublished - 15 Feb 2013

Abstract

Inorganic silica/alumina multilayer films with excellent mechanical and anti-atomic-oxygen erosion properties were fabricated on polyimide by the hybrid implanting and depositing processes. X-ray photoelectron spectroscopy demonstrated that the silica/alumina graded structures consisted of Si. O and Al. O bonds, as well as Al. O. Si and Al. O. C bonds in the transition layers. The results revealed that bonding between the alumina coating and the polymer occurred primarily via Al. O. C bonds, and Si. O. Al bonds were formed in the interface between silica and alumina coatings. The multilayer films presented good adhesion property, demonstrating that balanced internal stresses and alternating bonding structures were crucial for enhancing anti-crack performance. The multilayer inorganic films exhibited good anti-atomic-oxygen erosion properties were well matched with the behavior of adhesion property. © 2012.

Research Area(s)

  • Atomic oxygen, Erosion, Inorganic films, Plasma immersion ion implantation/deposition, X-ray photoelectron spectroscopy

Citation Format(s)

Interface analysis of inorganic films on polyimide with atomic oxygen exposure. / Huang, Yongxian; Lv, Shixiong; Tian, Xiubo; Fu, Ricky K.Y.; Chu, Paul K.

In: Surface and Coatings Technology, Vol. 216, 15.02.2013, p. 121-126.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review