Interdiffusion in copper-aluminum thin film bilayers. I. Structure and kinetics of sequential compound formation

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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Material Science

100
Aluminum Material Science
100
Thin Films Material Science
100
Copper Material Science
50
Temperature Material Science
50
Electron Microscopy Material Science
50
Electron Diffractio... Material Science
50
Activation Energy Material Science
50
Intermetallics Material Science

Keyphrases

100
Interdiffusion Keyphrases
100
CuAl Keyphrases
100
Aluminum-copper All... Keyphrases
100
Compound Formation Keyphrases
100
Aluminum Thin Films Keyphrases
66
CuAl2 Keyphrases
33
Transmission Electr... Keyphrases
33
Diffraction Keyphrases
33
Activation Energy Keyphrases
33
Rutherford Backscat... Keyphrases
33
Transmission Electr... Keyphrases
33
Al Thin Film Keyphrases
33
Intermetallic Compo... Keyphrases
33
Excess Al Keyphrases
33
Cu9Al4 Keyphrases

Chemistry

100
Structure Chemistry
100
Aluminum Chemistry
100
Sample Chemistry
100
Chemical Kinetics C... Chemistry
100
Interdiffusion Chemistry
100
Thickening Chemistry
100
formation Chemistry
50
Reaction Temperatur... Chemistry
50
Electron Microscopy Chemistry
50
Reaction Activation... Chemistry
50
Rutherford Backscat... Chemistry
50
Intermetallic Compo... Chemistry
50
Electron Diffractio... Chemistry
50
Time Chemistry
50
Amount Chemistry

INIS

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copper INIS
100
aluminum INIS
100
layers INIS
100
thin films INIS
100
kinetics INIS
50
transmission INIS
50
x-ray diffraction INIS
50
electron microscopy INIS
50
activation energy INIS
50
electron diffractio... INIS
50
intermetallic compo... INIS
50
rutherford backscat... INIS
Research OutputsResearch Output authored by Interdiffusion in copper-aluminum thin film bilayers. I. Structure and kinetics of sequential compound formation is tagged with the concept