Interactions between silver-palladium metallization and tin-lead-silver solder

Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

Overview

9 Scopus Citations

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Author(s)

G. Y. LI
Y. C. CHAN

Related Research Unit(s)

Department of Electrical Engineering

Detail(s)

Original language	English
Pages (from-to)	R13-R14
Journal / Publication	Physica Status Solidi (A) Applied Research
Volume	166
Issue number	2
Publication status	Published - Apr 1998

Link(s)

DOI	DOI https://doi.org/10.1002/(SICI)1521-396X(199804)166:2<R13::AID-PSSA999913>3.3.CO;2-X Final Published version
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Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-0032049303&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(663f99ad-5111-452a-ac04-6d01ad3076d5).html

Citation Format(s)

[ RIS ] [ BibTeX ]

Interactions between silver-palladium metallization and tin-lead-silver solder. / LI, G. Y.; CHAN, Y. C.

In: Physica Status Solidi (A) Applied Research, Vol. 166, No. 2, 04.1998, p. R13-R14.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

LI, GY & CHAN, YC 1998, 'Interactions between silver-palladium metallization and tin-lead-silver solder', Physica Status Solidi (A) Applied Research, vol. 166, no. 2, pp. R13-R14. https://doi.org/10.1002/(SICI)1521-396X(199804)166:2<R13::AID-PSSA999913>3.3.CO;2-X

LI, G. Y., & CHAN, Y. C. (1998). Interactions between silver-palladium metallization and tin-lead-silver solder. Physica Status Solidi (A) Applied Research, 166(2), R13-R14. https://doi.org/10.1002/(SICI)1521-396X(199804)166:2<R13::AID-PSSA999913>3.3.CO;2-X

LI GY, CHAN YC. Interactions between silver-palladium metallization and tin-lead-silver solder. Physica Status Solidi (A) Applied Research. 1998 Apr;166(2):R13-R14. doi: 10.1002/(SICI)1521-396X(199804)166:2<R13::AID-PSSA999913>3.3.CO;2-X

LI, G. Y. ; CHAN, Y. C. / Interactions between silver-palladium metallization and tin-lead-silver solder. In: Physica Status Solidi (A) Applied Research. 1998 ; Vol. 166, No. 2. pp. R13-R14.