Interaction of anti-adhesive silicone films with UV embossing resin

Y. H. Yan; M. B. Chan-Park; W. C. Ching; C. Y. Yue

doi:10.1016/j.apsusc.2004.12.013

Interaction of anti-adhesive silicone films with UV embossing resin

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Overview

11 Scopus Citations

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Author(s)

Y. H. Yan
M. B. Chan-Park
W. C. Ching
C. Y. Yue

Detail(s)

Original language	English
Pages (from-to)	332-339
Journal / Publication	Applied Surface Science
Volume	249
Issue number	1-4
Publication status	Published - 15 Aug 2005
Externally published	Yes

Link(s)

DOI	DOI https://doi.org/10.1016/j.apsusc.2004.12.013 Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-21244461520&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(d0f2d048-8f23-4d97-abd0-050bee0c6214).html

Abstract

The durability of two silicone films, which were formed from silicone-based release agents with different molecular weights (MW), as anti-adhesive coatings for molds used for UV embossing was investigated. Flat electroless nickel-plated polyester stamp and UV-curable polyethylene glycol diacrylate (PEGDA) were the mold and molding material, respectively. The surface chemical composition of the silicone films and the PEGDA moldings was analyzed by X-ray photoelectron spectroscopy (XPS) as a function of molding times using the same nickelized polyester stamp. Silicone transfer was found to occur from the silicone films to the moldings with increased number of moldings. The silicone film formed from the release agent with the higher MW had the poorer durability. Two mechanisms are proposed for the material transfer. © 2004 Elsevier B.V. All rights reserved.

Research Area(s)

Anti-adhesion, Silicone-based release agent, Thin film, UV molding, XPS

Bibliographic Note

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