Abstract
The durability of two silicone films, which were formed from silicone-based release agents with different molecular weights (MW), as anti-adhesive coatings for molds used for UV embossing was investigated. Flat electroless nickel-plated polyester stamp and UV-curable polyethylene glycol diacrylate (PEGDA) were the mold and molding material, respectively. The surface chemical composition of the silicone films and the PEGDA moldings was analyzed by X-ray photoelectron spectroscopy (XPS) as a function of molding times using the same nickelized polyester stamp. Silicone transfer was found to occur from the silicone films to the moldings with increased number of moldings. The silicone film formed from the release agent with the higher MW had the poorer durability. Two mechanisms are proposed for the material transfer. © 2004 Elsevier B.V. All rights reserved.
| Original language | English |
|---|---|
| Pages (from-to) | 332-339 |
| Journal | Applied Surface Science |
| Volume | 249 |
| Issue number | 1-4 |
| DOIs | |
| Publication status | Published - 15 Aug 2005 |
| Externally published | Yes |
Bibliographical note
Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].Research Keywords
- Anti-adhesion
- Silicone-based release agent
- Thin film
- UV molding
- XPS
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