Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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Author(s)

  • H. Y. Hsiao
  • C. C. Hu
  • M. Y. Guo
  • C. Chen
  • K. N. Tu

Detail(s)

Original languageEnglish
Pages (from-to)907-910
Journal / PublicationScripta Materialia
Volume65
Issue number10
Online published18 Aug 2011
Publication statusPublished - Nov 2011
Externally publishedYes

Link(s)

DOI

DOI
Check@CityULib
Link to Scopus https://www.scopus.com/record/display.uri?eid=2-s2.0-80053266335&origin=recordpage
Permanent Link https://scholars.cityu.edu.hk/en/publications/publication(58da8482-84f6-40b2-a995-c9f710f5d425).html

Abstract

An effective approach to inhibiting the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu is reported. By depositing a very thin layer of solder on Cu, followed by a 10-min reflow, the scallop-type morphology of interfacial Cu6Sn5 intermetallic compounds (IMC) became flat, and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMC was retarded. © 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Research Area(s)

  • 3D-IC packaging, Diffusion, Intermetallic compound, Soldering

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Publication fingerprints text

100
Soldering Keyphrases
100
Pb-free Solder Keyphrases
100
Multiple Reflows Keyphrases
100
Lead-Free Solder Material Science
100
Intermetallics Material Science
100
intermetallic compo... INIS
66
Intermetallic Compo... Keyphrases
50
Morphology Material Science
50
Soldering Alloys Material Science
50
growth INIS
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Citation Format(s)

[ RIS ] [ BibTeX ]
Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu. / Hsiao, H. Y.; Hu, C. C.; Guo, M. Y. et al.
In: Scripta Materialia, Vol. 65, No. 10, 11.2011, p. 907-910.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review