Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu

H. Y. Hsiao; C. C. Hu; M. Y. Guo; C. Chen; K. N. Tu

doi:10.1016/j.scriptamat.2011.08.008

Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu

H. Y. Hsiao, C. C. Hu, M. Y. Guo, C. Chen^*, K. N. Tu

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

17 Citations (Scopus)

Abstract

An effective approach to inhibiting the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu is reported. By depositing a very thin layer of solder on Cu, followed by a 10-min reflow, the scallop-type morphology of interfacial Cu₆Sn₅ intermetallic compounds (IMC) became flat, and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMC was retarded. © 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Original language	English
Pages (from-to)	907-910
Journal	Scripta Materialia
Volume	65
Issue number	10
Online published	18 Aug 2011
DOIs	https://doi.org/10.1016/j.scriptamat.2011.08.008
Publication status	Published - Nov 2011
Externally published	Yes

Research Keywords

3D-IC packaging
Diffusion
Intermetallic compound
Soldering

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10.1016/j.scriptamat.2011.08.008

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title = "Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu",

abstract = "An effective approach to inhibiting the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu is reported. By depositing a very thin layer of solder on Cu, followed by a 10-min reflow, the scallop-type morphology of interfacial Cu6Sn5 intermetallic compounds (IMC) became flat, and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMC was retarded. {\textcopyright} 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.",

keywords = "3D-IC packaging, Diffusion, Intermetallic compound, Soldering",

author = "Hsiao, {H. Y.} and Hu, {C. C.} and Guo, {M. Y.} and C. Chen and Tu, {K. N.}",

year = "2011",

month = nov,

doi = "10.1016/j.scriptamat.2011.08.008",

language = "English",

volume = "65",

pages = "907--910",

journal = "Scripta Materialia",

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T1 - Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu

AU - Hsiao, H. Y.

AU - Hu, C. C.

AU - Guo, M. Y.

AU - Chen, C.

AU - Tu, K. N.

PY - 2011/11

Y1 - 2011/11

N2 - An effective approach to inhibiting the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu is reported. By depositing a very thin layer of solder on Cu, followed by a 10-min reflow, the scallop-type morphology of interfacial Cu6Sn5 intermetallic compounds (IMC) became flat, and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMC was retarded. © 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

AB - An effective approach to inhibiting the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu is reported. By depositing a very thin layer of solder on Cu, followed by a 10-min reflow, the scallop-type morphology of interfacial Cu6Sn5 intermetallic compounds (IMC) became flat, and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMC was retarded. © 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

KW - 3D-IC packaging

KW - Diffusion

KW - Intermetallic compound

KW - Soldering

UR - http://www.scopus.com/inward/record.url?scp=80053266335&partnerID=8YFLogxK

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-80053266335&origin=recordpage

U2 - 10.1016/j.scriptamat.2011.08.008

DO - 10.1016/j.scriptamat.2011.08.008

M3 - RGC 21 - Publication in refereed journal

SN - 1359-6462

VL - 65

SP - 907

EP - 910

JO - Scripta Materialia

JF - Scripta Materialia

IS - 10

ER -

Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu

Abstract

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