Influence of the Implantation Voltage on Film Thickness During Plasma Ion Implantation/Deposition (PIID) Process

Xiubo Tian, L. P. Wang, Q. Y. Zhang, Paul K. Chu*

*Corresponding author for this work

    Research output: Conference PapersRGC 32 - Refereed conference paper (without host publication)peer-review

    Original languageEnglish
    Publication statusPublished - Sept 2000
    Event5th Asia-Pacific Conference on Plasma Science & Technology and 13th Symposium on Plasma Science for Materials - Dalian, China
    Duration: 10 Sept 200013 Sept 2000

    Conference

    Conference5th Asia-Pacific Conference on Plasma Science & Technology and 13th Symposium on Plasma Science for Materials
    Country/TerritoryChina
    CityDalian
    Period10/09/0013/09/00

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