Influence of Strain Rate on Mechanical Behaviours of Gradient-Structured Copper

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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Author(s)

  • Jinxu Zhang
  • Yang Cao
  • Hongliang Gao
  • Xu Yang
  • Baipo Shu
  • Bhupendra Sharma
  • Kei Ameyama
  • Xinkun Zhu

Detail(s)

Original languageEnglish
Pages (from-to)708-717
Journal / PublicationMaterials Transactions
Volume61
Issue number4
Online published2 Mar 2020
Publication statusPublished - Apr 2020
Externally publishedYes

Abstract

The mechanical properties of gradient-structured (GS) pure Cu processed by surface mechanical attrition treatment (SMAT) were investigated by tensile tests at different strain rates in the range of 5 × 10-4 s-1 to 5 × 10-2 s-1 at room temperature. The yield strength (YS), ultimate tensile strength (UTS) and ductility (uniform elongation, UE) of the gradient-structured Cu are simultaneously increased with increasing strain rate, especially for the sample processed by longer SMAT-treating time, while the coarse-grained (CG) Cu showed no obvious strain rate effect on strength and ductility. In addition, the strain rate sensitivity (m) and hetero-deformation induced (HDI) stress of the gradient-structured samples also increased with increasing strain rate. The increase in strength is mainly attributed to the gradient-structured layers and HDI stress strengthening. On the other hand, the increase in ductility can be attributed to an increase in strain rate sensitivity (m) and the strain hardening induced by the accumulation of a large number of geometrically necessary dislocations (GNDS) caused by a large stress gradient (HDI hardening).

Research Area(s)

  • Copper, Gradient structure, Mechanical properties, Strain rate, Strain rate sensitivity

Citation Format(s)

Influence of Strain Rate on Mechanical Behaviours of Gradient-Structured Copper. / Zhang, Jinxu; Cao, Yang; Gao, Hongliang et al.
In: Materials Transactions, Vol. 61, No. 4, 04.2020, p. 708-717.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review