Influence of external constraint on deformation banding of copper single crystals of {110}〈uvw〉 orientations

Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

Overview

5 Scopus Citations

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Author(s)

K. C. Lee
Y. P. Zeng
C. S. Lee

Detail(s)

Original language	English
Pages (from-to)	197-202
Journal / Publication	Scripta Materialia
Volume	40
Issue number	2
Publication status	Published - Dec 1998

Link(s)

DOI	DOI https://doi.org/10.1016/S1359-6462(98)00420-5 Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-0032290770&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(f2c6065f-2bb4-4d5f-ab25-9ce23aa6ea94).html

Citation Format(s)

[ RIS ] [ BibTeX ]

Influence of external constraint on deformation banding of copper single crystals of {110}〈uvw〉 orientations. / Lee, K. C.; Zeng, Y. P.; Lee, C. S.
In: Scripta Materialia, Vol. 40, No. 2, 12.1998, p. 197-202.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

Lee, KC, Zeng, YP & Lee, CS 1998, 'Influence of external constraint on deformation banding of copper single crystals of {110}〈uvw〉 orientations', Scripta Materialia, vol. 40, no. 2, pp. 197-202. https://doi.org/10.1016/S1359-6462(98)00420-5

Lee, K. C., Zeng, Y. P., & Lee, C. S. (1998). Influence of external constraint on deformation banding of copper single crystals of {110}〈uvw〉 orientations. Scripta Materialia, 40(2), 197-202. https://doi.org/10.1016/S1359-6462(98)00420-5

Lee KC, Zeng YP, Lee CS. Influence of external constraint on deformation banding of copper single crystals of {110}〈uvw〉 orientations. Scripta Materialia. 1998 Dec;40(2):197-202. doi: 10.1016/S1359-6462(98)00420-5

Lee, K. C. ; Zeng, Y. P. ; Lee, C. S. / Influence of external constraint on deformation banding of copper single crystals of {110}〈uvw〉 orientations. In: Scripta Materialia. 1998 ; Vol. 40, No. 2. pp. 197-202.