Influence of diamond additions on lead-free Sn-Zn-Bi Solder-alloys

Pei Qin; Xiao Hu; Y. C. Chan

doi:10.1109/ESTC.2012.6542091

Influence of diamond additions on lead-free Sn-Zn-Bi Solder-alloys

Pei Qin
, Xiao Hu
, Y. C. Chan^*

^*Corresponding author for this work

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

Abstract

In this work, diamond nano-particles doped Sn-8Zn-3Bi solder alloys have been studied. The microstructure and the interfacial reactions of the plain solder joints and solder joints containing diamond nano-particles were investigated under current density of 5×10³ A/cm² at temperature of 100°C with Cu pads on daisy chain type ball grid array (BGA) substrates. It was found diamond nano-particles doped in solder joints refined the microstructure and retarded the formation of Cu₅Zn₈ intermetallic compounds (IMCs). The shear strength of solder joints containing diamond nano-particles exhibited higher value than that of plain solder joint. In addition, the fracture surface of doped solder joints appeared ductile behavior with very rough dimpled surfaces. DSC analyses of plain and doped solders revealed the onset and melting temperatures of solder alloys with diamond additions kept nearly unchanged, indicating its potentially viable applications and benefits.

Original language	English
Title of host publication	2012 4th Electronic System-Integration Technology Conference, ESTC 2012
Publisher	IEEE Computer Society
ISBN (Print)	9781467346450
DOIs	https://doi.org/10.1109/ESTC.2012.6542091
Publication status	Published - 2012
Event	2012 4th Electronic System-Integration Technology Conference, ESTC 2012 - Amsterdam, Netherlands Duration: 17 Sept 2012 → 20 Sept 2012

Conference

Conference	2012 4th Electronic System-Integration Technology Conference, ESTC 2012
Place	Netherlands
City	Amsterdam
Period	17/09/12 → 20/09/12

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10.1109/ESTC.2012.6542091

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@inproceedings{6333d49d939a430fb2513520f9c5f430,

title = "Influence of diamond additions on lead-free Sn-Zn-Bi Solder-alloys",

abstract = "In this work, diamond nano-particles doped Sn-8Zn-3Bi solder alloys have been studied. The microstructure and the interfacial reactions of the plain solder joints and solder joints containing diamond nano-particles were investigated under current density of 5×103 A/cm2 at temperature of 100°C with Cu pads on daisy chain type ball grid array (BGA) substrates. It was found diamond nano-particles doped in solder joints refined the microstructure and retarded the formation of Cu5Zn8 intermetallic compounds (IMCs). The shear strength of solder joints containing diamond nano-particles exhibited higher value than that of plain solder joint. In addition, the fracture surface of doped solder joints appeared ductile behavior with very rough dimpled surfaces. DSC analyses of plain and doped solders revealed the onset and melting temperatures of solder alloys with diamond additions kept nearly unchanged, indicating its potentially viable applications and benefits.",

author = "Pei Qin and Xiao Hu and Chan, \{Y. C.\}",

year = "2012",

doi = "10.1109/ESTC.2012.6542091",

language = "English",

isbn = "9781467346450",

booktitle = "2012 4th Electronic System-Integration Technology Conference, ESTC 2012",

publisher = "IEEE Computer Society",

address = "United States",

note = "2012 4th Electronic System-Integration Technology Conference, ESTC 2012 ; Conference date: 17-09-2012 Through 20-09-2012",

}

TY - GEN

T1 - Influence of diamond additions on lead-free Sn-Zn-Bi Solder-alloys

AU - Qin, Pei

AU - Hu, Xiao

AU - Chan, Y. C.

PY - 2012

Y1 - 2012

N2 - In this work, diamond nano-particles doped Sn-8Zn-3Bi solder alloys have been studied. The microstructure and the interfacial reactions of the plain solder joints and solder joints containing diamond nano-particles were investigated under current density of 5×103 A/cm2 at temperature of 100°C with Cu pads on daisy chain type ball grid array (BGA) substrates. It was found diamond nano-particles doped in solder joints refined the microstructure and retarded the formation of Cu5Zn8 intermetallic compounds (IMCs). The shear strength of solder joints containing diamond nano-particles exhibited higher value than that of plain solder joint. In addition, the fracture surface of doped solder joints appeared ductile behavior with very rough dimpled surfaces. DSC analyses of plain and doped solders revealed the onset and melting temperatures of solder alloys with diamond additions kept nearly unchanged, indicating its potentially viable applications and benefits.

AB - In this work, diamond nano-particles doped Sn-8Zn-3Bi solder alloys have been studied. The microstructure and the interfacial reactions of the plain solder joints and solder joints containing diamond nano-particles were investigated under current density of 5×103 A/cm2 at temperature of 100°C with Cu pads on daisy chain type ball grid array (BGA) substrates. It was found diamond nano-particles doped in solder joints refined the microstructure and retarded the formation of Cu5Zn8 intermetallic compounds (IMCs). The shear strength of solder joints containing diamond nano-particles exhibited higher value than that of plain solder joint. In addition, the fracture surface of doped solder joints appeared ductile behavior with very rough dimpled surfaces. DSC analyses of plain and doped solders revealed the onset and melting temperatures of solder alloys with diamond additions kept nearly unchanged, indicating its potentially viable applications and benefits.

UR - https://www.scopus.com/pages/publications/84902439053

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84902439053&origin=recordpage

U2 - 10.1109/ESTC.2012.6542091

DO - 10.1109/ESTC.2012.6542091

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 9781467346450

BT - 2012 4th Electronic System-Integration Technology Conference, ESTC 2012

PB - IEEE Computer Society

T2 - 2012 4th Electronic System-Integration Technology Conference, ESTC 2012

Y2 - 17 September 2012 through 20 September 2012

ER -

Influence of diamond additions on lead-free Sn-Zn-Bi Solder-alloys

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