Influence of copper content and nanograin size on toughness of copper containing diamond-like carbon films

Z. W. Ning, X. Yu, M. Hua, C. B. Wang

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    7 Citations (Scopus)

    Abstract

    Five copper containing diamond-like carbon films (Cu-DLC), each with a particular content of Cu, were deposited on Si (100) substrates in an ion beam assisted deposition system. The influence of Cu content and nanograin size on film toughness has been investigated along with verifying through the microstructural, mechanical and sliding tribological behaviours of the films. Variation of Cu content and nanocrystallites dispersing in DLC matrix induces corresponding modification in film toughness as well as hardness, intrinsic stress and sliding frictional behaviour, resulting in improvement of film toughness for the combined tribological performances. The film toughness was investigated by scratch crack propagation resistance from the critical load data obtained from scratch test. Results revealed that doping Cu with nanograin sizes, especially at a suitable content of 10·5 at-%, will significantly improve the crack initiation resistance and propagation resistance of crack during scratch test, demonstrating the improved toughness. © W. S. Maney & Son Ltd. 2013.
    Original languageEnglish
    JournalMaterials Research Innovations
    Volume17
    Issue numberSUPPL. 1
    DOIs
    Publication statusPublished - Jul 2013

    Research Keywords

    • Copper incorporation
    • Diamond-like carbon film
    • Ion beam assisted deposition
    • Toughness

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