In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing

Y. H. Lin, Y. C. Hu, C. M. Tsai, C. R. Kao, K. N. Tu

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

159 Citations (Scopus)

Fingerprint

Dive into the research topics of 'In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing'. Together they form a unique fingerprint.

Earth and Planetary Sciences

Engineering

Material Science