In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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Author(s)

  • Di Xu
  • Vinay Sriram
  • Vidvuds Ozolins
  • Jenn-Ming Yang
  • Gery R. Stafford
  • Carlos Beauchamp

Detail(s)

Original languageEnglish
Article number023521
Journal / PublicationJournal of Applied Physics
Volume105
Issue number2
Publication statusPublished - 15 Jan 2009
Externally publishedYes

Abstract

In situ stress measurements were performed during high frequency pulse electrodeposition of nanotwinned Cu thin films. Periodic stress changes during pulse-on and pulse-off periods were observed. The stress profile showed an abrupt increase in tensile stress to about 400 MPa during the pulse-on period and a stress relaxation during the pulse-off period. First-principles calculations predict that a complete relaxation of the tensile stress allows the formation of nanotwins separated by 28 nm or more. This is in good agreement with the results obtained from microstructural analysis of the Cu films fabricated during in situ stress measurements. © 2009 American Institute of Physics.

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Citation Format(s)

In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper. / Xu, Di; Sriram, Vinay; Ozolins, Vidvuds et al.
In: Journal of Applied Physics, Vol. 105, No. 2, 023521, 15.01.2009.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review