In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper

Di Xu; Vinay Sriram; Vidvuds Ozolins; Jenn-Ming Yang; K. N. Tu; Gery R. Stafford; Carlos Beauchamp

doi:10.1063/1.3068191

Author(s)

Di Xu
Vinay Sriram
Vidvuds Ozolins
Jenn-Ming Yang
Gery R. Stafford
Carlos Beauchamp

Detail(s)

Original language	English
Article number	023521
Journal / Publication	Journal of Applied Physics
Volume	105
Issue number	2
Publication status	Published - 15 Jan 2009
Externally published	Yes

Link(s)

DOI	DOI https://doi.org/10.1063/1.3068191 Final Published version
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Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-59349114488&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(daa9dad8-117e-46a8-8d5d-273df28af1f1).html

Abstract

In situ stress measurements were performed during high frequency pulse electrodeposition of nanotwinned Cu thin films. Periodic stress changes during pulse-on and pulse-off periods were observed. The stress profile showed an abrupt increase in tensile stress to about 400 MPa during the pulse-on period and a stress relaxation during the pulse-off period. First-principles calculations predict that a complete relaxation of the tensile stress allows the formation of nanotwins separated by 28 nm or more. This is in good agreement with the results obtained from microstructural analysis of the Cu films fabricated during in situ stress measurements. © 2009 American Institute of Physics.

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Citation Format(s)

[ RIS ] [ BibTeX ]

In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper. / Xu, Di; Sriram, Vinay; Ozolins, Vidvuds et al.
In: Journal of Applied Physics, Vol. 105, No. 2, 023521, 15.01.2009.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Xu, D, Sriram, V, Ozolins, V, Yang, J-M, Tu, KN, Stafford, GR & Beauchamp, C 2009, 'In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper', Journal of Applied Physics, vol. 105, no. 2, 023521. https://doi.org/10.1063/1.3068191

Xu, D., Sriram, V., Ozolins, V., Yang, J.-M., Tu, K. N., Stafford, G. R., & Beauchamp, C. (2009). In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper. Journal of Applied Physics, 105(2), Article 023521. https://doi.org/10.1063/1.3068191

Xu D, Sriram V, Ozolins V, Yang JM, Tu KN, Stafford GR et al. In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper. Journal of Applied Physics. 2009 Jan 15;105(2):023521. doi: 10.1063/1.3068191

Xu, Di ; Sriram, Vinay ; Ozolins, Vidvuds et al. / In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper. In: Journal of Applied Physics. 2009 ; Vol. 105, No. 2.