In-sensor compressing via programmable optoelectronic sensors based on van der Waals heterostructures for intelligent machine vision

Haoxin Huang (Co-first Author), Shuhui Shi (Co-first Author), Jiajia Zha (Co-first Author), Yunpeng Xia, Huide Wang, Peng Yang, Long Zheng, Songcen Xu, Wei Wang, Yi Ren, Yongji Wang, Ye Chen, Hau Ping Chan, Johnny C. Ho, Yang Chai*, Zhongrui Wang*, Chaoliang Tan*

*Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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Abstract

Efficiently capturing multidimensional signals containing spectral and temporal information is crucial for intelligent machine vision. Although in-sensor computing shows promise for efficient visual processing by reducing data transfer, its capability to compress temporal/spectral data is rarely reported. Here we demonstrate a programmable two-dimensional (2D) heterostructure-based optoelectronic sensor integrating sensing, memory, and computation for in-sensor data compression. Our 2D sensor captured and memorized/encoded optical signals, leading to in-device snapshot compression of dynamic videos and three-dimensional spectral data with a compression ratio of 8:1. The reconstruction quality, indicated by a peak signal-to-noise ratio value of 15.81 dB, is comparable to the 16.21 dB achieved through software. Meanwhile, the compressed action videos (in the form of 2D images) preserve all semantic information and can be accurately classified using in-sensor convolution without decompression, achieving accuracy on par with uncompressed videos (93.18% vs 83.43%). Our 2D optoelectronic sensors promote the development of efficient intelligent vision systems at the edge. © The Author(s) 2025.
Original languageEnglish
Article number3836
JournalNature Communications
Volume16
Online published24 Apr 2025
DOIs
Publication statusPublished - 2025

Funding

This research is supported by the National Key R&D Program of China (Grant No. 2023YFB2806300). C.T. thanks the funding support from the National Natural Science Foundation of China \u2013 Excellent Young Scientists Fund (Hong Kong and Macau) (No. 52122002), the Start-Up Grant (Project No. 9610710) from City University of Hong Kong, ECS scheme (21201821), General Research Fund (11200122) and the Collaborative Research Fund (RGC; no. C2001-23Y and C5001-24Y) from the Research Grant Council of Hong Kong and ITC via Hong Kong Branch of National Precious Metals Material Engineering Research Center (NPMM). Z.W. thanked the support from the National Natural Science Foundation of China (Grant Nos. 62122004, 62374181), Beijing Natural Science Foundation (Grant No. Z210006), Hong Kong Research Grant Council (Grant Nos. 27206321, 17205922, 17212923). This research is also partially supported by ACCESS \u2013 AI Chip Center for Emerging Smart Systems, sponsored by Innovation and Technology Fund (ITF), Hong Kong SAR. Y.C. Thanks the funding support from the General Research Fund (15301621) from the Research Grant Council of Hong Kong. P.Y. thanks the funding support from the National Natural Science Foundation of China (Grant No. 62404138) and Shenzhen Science and Technology Program (Grant No. 20231128102926002).

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