Improvements in transmittance, mechanical properties and thermal stability of silica-polyimide composite films by a novel sol-gel route

Yan Li; Shao-Yun Fu; Yuan-Qing Li; Qin-Yan Pan; Guanshui Xu; Chee-Yoon Yue

doi:10.1016/j.compscitech.2007.01.003

Improvements in transmittance, mechanical properties and thermal stability of silica-polyimide composite films by a novel sol-gel route

Yan Li
, Shao-Yun Fu
, Yuan-Qing Li
, Qin-Yan Pan
, Guanshui Xu
, Chee-Yoon Yue

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

62 Citations (Scopus)

Abstract

Sol-gel process has been frequently employed for preparation of silica/polyimide composite films. In this article, a novel sol-gel route is introduced to prepare silica (SiO₂)/polyimide (PI) (PS2 system) composite films and to enhance the compatibility between the polyimide and silica. The transmittance, mechanical properties, thermal stability, and morphology of the PS2 composites are studied and compared with the PS1 films prepared by the traditional sol-gel route. The results show that the transmittance, mechanical properties and thermal stability of the PS2 composites are significantly improved especially at high silica contents when compared with those of their counterparts prepared by the traditional sol-gel route. This is explained in terms of the silica particle size and dispersion in the two composites. In addition, the effect of silica particle size on the thermal expansion of silica/PI films is also examined. © 2007 Elsevier Ltd. All rights reserved.

Original language	English
Pages (from-to)	2408-2416
Journal	Composites Science and Technology
Volume	67
Issue number	11-12
DOIs	https://doi.org/10.1016/j.compscitech.2007.01.003
Publication status	Published - Sept 2007
Externally published	Yes

Bibliographical note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Research Keywords

Composites
Mechanical properties
Sol-gel
Thermal expansion
Thermal stability
Transmittance

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title = "Improvements in transmittance, mechanical properties and thermal stability of silica-polyimide composite films by a novel sol-gel route",

abstract = "Sol-gel process has been frequently employed for preparation of silica/polyimide composite films. In this article, a novel sol-gel route is introduced to prepare silica (SiO2)/polyimide (PI) (PS2 system) composite films and to enhance the compatibility between the polyimide and silica. The transmittance, mechanical properties, thermal stability, and morphology of the PS2 composites are studied and compared with the PS1 films prepared by the traditional sol-gel route. The results show that the transmittance, mechanical properties and thermal stability of the PS2 composites are significantly improved especially at high silica contents when compared with those of their counterparts prepared by the traditional sol-gel route. This is explained in terms of the silica particle size and dispersion in the two composites. In addition, the effect of silica particle size on the thermal expansion of silica/PI films is also examined. {\textcopyright} 2007 Elsevier Ltd. All rights reserved.",

keywords = "Composites, Mechanical properties, Sol-gel, Thermal expansion, Thermal stability, Transmittance",

author = "Yan Li and Shao-Yun Fu and Yuan-Qing Li and Qin-Yan Pan and Guanshui Xu and Chee-Yoon Yue",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected]. ",

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doi = "10.1016/j.compscitech.2007.01.003",

language = "English",

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pages = "2408--2416",

journal = "Composites Science and Technology",

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}

Improvements in transmittance, mechanical properties and thermal stability of silica-polyimide composite films by a novel sol-gel route. / Li, Yan; Fu, Shao-Yun; Li, Yuan-Qing et al.
In: Composites Science and Technology, Vol. 67, No. 11-12, 09.2007, p. 2408-2416.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

TY - JOUR

T1 - Improvements in transmittance, mechanical properties and thermal stability of silica-polyimide composite films by a novel sol-gel route

AU - Li, Yan

AU - Fu, Shao-Yun

AU - Li, Yuan-Qing

AU - Pan, Qin-Yan

AU - Xu, Guanshui

AU - Yue, Chee-Yoon

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2007/9

Y1 - 2007/9

N2 - Sol-gel process has been frequently employed for preparation of silica/polyimide composite films. In this article, a novel sol-gel route is introduced to prepare silica (SiO2)/polyimide (PI) (PS2 system) composite films and to enhance the compatibility between the polyimide and silica. The transmittance, mechanical properties, thermal stability, and morphology of the PS2 composites are studied and compared with the PS1 films prepared by the traditional sol-gel route. The results show that the transmittance, mechanical properties and thermal stability of the PS2 composites are significantly improved especially at high silica contents when compared with those of their counterparts prepared by the traditional sol-gel route. This is explained in terms of the silica particle size and dispersion in the two composites. In addition, the effect of silica particle size on the thermal expansion of silica/PI films is also examined. © 2007 Elsevier Ltd. All rights reserved.

AB - Sol-gel process has been frequently employed for preparation of silica/polyimide composite films. In this article, a novel sol-gel route is introduced to prepare silica (SiO2)/polyimide (PI) (PS2 system) composite films and to enhance the compatibility between the polyimide and silica. The transmittance, mechanical properties, thermal stability, and morphology of the PS2 composites are studied and compared with the PS1 films prepared by the traditional sol-gel route. The results show that the transmittance, mechanical properties and thermal stability of the PS2 composites are significantly improved especially at high silica contents when compared with those of their counterparts prepared by the traditional sol-gel route. This is explained in terms of the silica particle size and dispersion in the two composites. In addition, the effect of silica particle size on the thermal expansion of silica/PI films is also examined. © 2007 Elsevier Ltd. All rights reserved.

KW - Composites

KW - Mechanical properties

KW - Sol-gel

KW - Thermal expansion

KW - Thermal stability

KW - Transmittance

UR - https://www.scopus.com/pages/publications/34248595627

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-34248595627&origin=recordpage

U2 - 10.1016/j.compscitech.2007.01.003

DO - 10.1016/j.compscitech.2007.01.003

M3 - RGC 21 - Publication in refereed journal

SN - 0266-3538

VL - 67

SP - 2408

EP - 2416

JO - Composites Science and Technology

JF - Composites Science and Technology

IS - 11-12

ER -

Improvements in transmittance, mechanical properties and thermal stability of silica-polyimide composite films by a novel sol-gel route

Abstract

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