Skip to main navigation Skip to search Skip to main content

Improvement of nitrogen retained dose using ammonia as a precursor in nitrogen plasma immersion ion implantation of silicon

  • G. J. Wan
  • , P. Yang
  • , Ricky K. Y. Fu
  • , Zh Q. Yao
  • , N. Huang
  • , Paul K. Chu

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Abstract

    The low nitrogen retained dose due to competition from oxygen coimplantation diminishes the efficacy of nitrogen plasma immersion ion implantation in silicon. In this work, we aim at improving the nitrogen retained dose by using ammonia as a precursor. Ammonia is introduced into the nitrogen plasma during plasma immersion ion implantation of silicon to improve the nitrogen reactivity and reduce the competition from oxygen in the residual vacuum. Our x-ray photoelectron spectroscopy and Fourier-transform infrared spectroscopy results indicate that the ammonia precursor can indeed improve the N retained dose effectively, and the hydrophilic properties of the surface change with different ammonia to nitrogen ratios. © 2005 American Vacuum Society.
    Original languageEnglish
    Pages (from-to)1346-1349
    JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
    Volume23
    Issue number5
    DOIs
    Publication statusPublished - Sept 2005

    Fingerprint

    Dive into the research topics of 'Improvement of nitrogen retained dose using ammonia as a precursor in nitrogen plasma immersion ion implantation of silicon'. Together they form a unique fingerprint.

    Cite this