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Improved ion implant fluence uniformity in hydrogen enhanced glow discharge plasma immersion ion implantation into silicon

J. Luo, L. H. Li, H. T. Liu, K. M. Yu, Y. Xu, X. J. Zuo, P. Z. Zhu, Y. F. Ma, Ricky K. Y. Fu, Paul K. Chu

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    38 Downloads (CityUHK Scholars)

    Abstract

    Enhanced glow discharge plasma immersion ion implantation does not require an external plasma source but ion focusing affects the lateral ion fluence uniformity, thereby hampering its use in high-fluence hydrogen ion implantation for thin film transfer and fabrication of silicon-on-insulator. Insertion of a metal ring between the sample stage and glass chamber improves the ion uniformity and reduces the ion fluence non-uniformity as the cathode voltage is raised. Two-dimensional multiple-grid particle-in-cell simulation confirms that the variation of electric field inside the chamber leads to mitigation of the ion focusing phenomenon and the results are corroborated experimentally by hydrogen forward scattering. © 2014 AIP Publishing LLC.
    Original languageEnglish
    Article number63506
    JournalReview of Scientific Instruments
    Volume85
    Issue number6
    DOIs
    Publication statusPublished - Jun 2014

    UN SDGs

    This output contributes to the following UN Sustainable Development Goals (SDGs)

    1. SDG 7 - Affordable and Clean Energy
      SDG 7 Affordable and Clean Energy

    Publisher's Copyright Statement

    • COPYRIGHT TERMS OF DEPOSITED FINAL PUBLISHED VERSION FILE: This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. This article appeared in J. Luo, L. H. Li, H. T. Liu, K. M. Yu, Y. Xu, X. J. Zuo, P. Z. Zhu, Y. F. Ma, Ricky K. Y. Fu, and Paul K. Chu , "Improved ion implant fluence uniformity in hydrogen enhanced glow discharge plasma immersion ion implantation into silicon", Review of Scientific Instruments 85, 063506 (2014) and may be found at https://doi.org/10.1063/1.4875982.

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