Implantation dynamics of plasma immersion ion implantation into non-conductive materials and applications

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)22_Publication in policy or professional journal

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Detail(s)

Original languageEnglish
Article number3P27
Journal / PublicationIEEE International Conference on Plasma Science
Publication statusPublished - 2004

Conference

Title31st IEEE International Conference on Plasma Science (ICOPS2004)
PlaceUnited States
CityBaltimore
Period28 June - 1 July 2004

Abstract

Non-conductive materials such as dielectrics, polymers and ceramics are widely used in the industry. Many techniques have been developed to enhance the surface properties and extend the applications of these materials. In the work described here, the use of plasma immersion ion implantation (PHI) on non-conductive materials was investigated via theoretical and experimental means. Computer simulation was utilized to model the implantation dynamics of the plasma sheath, surface potential, surface charge distribution, ion implant dose, implant uniformity, and other parameters and factors during PHI of insulators. Systematic experiments were also conducted to evaluate the effects of various plasma parameters and placement configurations on the sample properties and implantation efficacy. Our results show that in general, a low plasma density and short-pulse mode are preferred as there will be less surface charging, a smaller potential drop on the sample surface, and a thinner plasma sheath. Based on findings in our studies, gases and metals have been implanted into some nonconductive materials to improve their surface energy, conductivity, mechanical and tribological properties. These empirical results will be presented as well.