TY - JOUR
T1 - IMMERSION TIN
T2 - ITS CHEMISTRY, METALLURGY, AND APPLICATION IN ELECTRONIC PACKAGING TECHNOLOGY.
AU - Kovac, Zlata
AU - Tu, King Ning
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 1984
Y1 - 1984
N2 - The surfaces in copper-plated through-holes in printed circuit boards for complex electronic packaging can be made solderable by immersion deposition of tin. The properties of the prepared surfaces vary from those of 'white immersion tin,' which is easily wetted by molten tin solder, to those of 'gray immersion tin,' which is nearly nonwettable. In this paper, the rate law for tin deposition in the tin immersion plating bath is studied. Certain effects of chemical composition of the plating bath upon the character of the tin layer are investigated and the effects of thermal annealing of the plated surface upon the composition of the tin layer are determined. The differences in composition of white and gray immersion tin surface coatings are revealed by X-ray diffraction Rutherford backscattering spectroscopy and Auger electron spectroscopy. Solderability tests on Sn, Cu, Cu//3Sn, and immersion tin surfaces are included.
AB - The surfaces in copper-plated through-holes in printed circuit boards for complex electronic packaging can be made solderable by immersion deposition of tin. The properties of the prepared surfaces vary from those of 'white immersion tin,' which is easily wetted by molten tin solder, to those of 'gray immersion tin,' which is nearly nonwettable. In this paper, the rate law for tin deposition in the tin immersion plating bath is studied. Certain effects of chemical composition of the plating bath upon the character of the tin layer are investigated and the effects of thermal annealing of the plated surface upon the composition of the tin layer are determined. The differences in composition of white and gray immersion tin surface coatings are revealed by X-ray diffraction Rutherford backscattering spectroscopy and Auger electron spectroscopy. Solderability tests on Sn, Cu, Cu//3Sn, and immersion tin surfaces are included.
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U2 - 10.1147/rd.286.0726
DO - 10.1147/rd.286.0726
M3 - RGC 21 - Publication in refereed journal
SN - 0018-8646
VL - 28
SP - 726
EP - 734
JO - IBM Journal of Research and Development
JF - IBM Journal of Research and Development
IS - 6
ER -