In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper

Di Xu; Vinay Sriram; Vidvuds Ozolins; Jenn-Ming Yang; K. N. Tu; Gery R. Stafford; Carlos Beauchamp

doi:10.1063/1.3068191

In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper

Di Xu^*
, Vinay Sriram
, Vidvuds Ozolins
, Jenn-Ming Yang
, K. N. Tu
, Gery R. Stafford
, Carlos Beauchamp

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

92 Citations (Scopus)

Abstract

In situ stress measurements were performed during high frequency pulse electrodeposition of nanotwinned Cu thin films. Periodic stress changes during pulse-on and pulse-off periods were observed. The stress profile showed an abrupt increase in tensile stress to about 400 MPa during the pulse-on period and a stress relaxation during the pulse-off period. First-principles calculations predict that a complete relaxation of the tensile stress allows the formation of nanotwins separated by 28 nm or more. This is in good agreement with the results obtained from microstructural analysis of the Cu films fabricated during in situ stress measurements. © 2009 American Institute of Physics.

Original language	English
Article number	023521
Journal	Journal of Applied Physics
Volume	105
Issue number	2
DOIs	https://doi.org/10.1063/1.3068191
Publication status	Published - 15 Jan 2009
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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@article{daa9dad8117e46a88d5d273df28af1f1,

title = "In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper",

abstract = "In situ stress measurements were performed during high frequency pulse electrodeposition of nanotwinned Cu thin films. Periodic stress changes during pulse-on and pulse-off periods were observed. The stress profile showed an abrupt increase in tensile stress to about 400 MPa during the pulse-on period and a stress relaxation during the pulse-off period. First-principles calculations predict that a complete relaxation of the tensile stress allows the formation of nanotwins separated by 28 nm or more. This is in good agreement with the results obtained from microstructural analysis of the Cu films fabricated during in situ stress measurements. {\textcopyright} 2009 American Institute of Physics.",

author = "Di Xu and Vinay Sriram and Vidvuds Ozolins and Jenn-Ming Yang and Tu, \{K. N.\} and Stafford, \{Gery R.\} and Carlos Beauchamp",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected]. ",

year = "2009",

month = jan,

day = "15",

doi = "10.1063/1.3068191",

language = "English",

volume = "105",

journal = "Journal of Applied Physics",

issn = "0021-8979",

publisher = "American Institute of Physics",

number = "2",

}

TY - JOUR

T1 - In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper

AU - Xu, Di

AU - Sriram, Vinay

AU - Ozolins, Vidvuds

AU - Yang, Jenn-Ming

AU - Tu, K. N.

AU - Stafford, Gery R.

AU - Beauchamp, Carlos

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2009/1/15

Y1 - 2009/1/15

N2 - In situ stress measurements were performed during high frequency pulse electrodeposition of nanotwinned Cu thin films. Periodic stress changes during pulse-on and pulse-off periods were observed. The stress profile showed an abrupt increase in tensile stress to about 400 MPa during the pulse-on period and a stress relaxation during the pulse-off period. First-principles calculations predict that a complete relaxation of the tensile stress allows the formation of nanotwins separated by 28 nm or more. This is in good agreement with the results obtained from microstructural analysis of the Cu films fabricated during in situ stress measurements. © 2009 American Institute of Physics.

AB - In situ stress measurements were performed during high frequency pulse electrodeposition of nanotwinned Cu thin films. Periodic stress changes during pulse-on and pulse-off periods were observed. The stress profile showed an abrupt increase in tensile stress to about 400 MPa during the pulse-on period and a stress relaxation during the pulse-off period. First-principles calculations predict that a complete relaxation of the tensile stress allows the formation of nanotwins separated by 28 nm or more. This is in good agreement with the results obtained from microstructural analysis of the Cu films fabricated during in situ stress measurements. © 2009 American Institute of Physics.

UR - https://www.scopus.com/pages/publications/59349114488

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-59349114488&origin=recordpage

U2 - 10.1063/1.3068191

DO - 10.1063/1.3068191

M3 - RGC 21 - Publication in refereed journal

SN - 0021-8979

VL - 105

JO - Journal of Applied Physics

JF - Journal of Applied Physics

IS - 2

M1 - 023521

ER -

In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper

Abstract

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Erratum: "In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper" [J. Appl. Phys. 105, 023521 (2009)]

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