Ic Package With Nanotwinning-Assisted Structurally Stable Copper Structure

混合細晶粒/奈米雙晶銅之耐蝕性應用於重分佈銅層

Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)

Overview

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Author(s)

Shien Ping FENG (Inventor)
Chih Chun CHUNG (Inventor)
Sheng Jye CHERNG (Inventor)
Kaiyu MU (Inventor)

Related Research Unit(s)

Department of Systems Engineering

Detail(s)

Original language	English
Filing number	18/435,979
Publication status	Accepted/In press/Filed - 7 Feb 2024

Link(s)

	Check@CityULib
Other link(s)	View Technology Brief
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(88a1e0e9-68b9-4735-a2b3-3f421cc20b65).html

Citation Format(s)

[ RIS ] [ BibTeX ]

Ic Package With Nanotwinning-Assisted Structurally Stable Copper Structure. / FENG, Shien Ping (Inventor); CHUNG, Chih Chun (Inventor); CHERNG, Sheng Jye (Inventor) et al.
Feb 07, 2024.

Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)

FENG, SP, CHUNG, CC, CHERNG, SJ & MU, K Feb. 07 2024, Ic Package With Nanotwinning-Assisted Structurally Stable Copper Structure.

FENG, S. P., CHUNG, C. C., CHERNG, S. J., & MU, K. (in press). Ic Package With Nanotwinning-Assisted Structurally Stable Copper Structure.

FENG SP, CHUNG CC, CHERNG SJ, MU K, inventors. Ic Package With Nanotwinning-Assisted Structurally Stable Copper Structure. 2024 Feb 7.

FENG, Shien Ping (Inventor) ; CHUNG, Chih Chun (Inventor) ; CHERNG, Sheng Jye (Inventor) et al. / Ic Package With Nanotwinning-Assisted Structurally Stable Copper Structure. Feb 07, 2024.