| Translated title of the contribution | 具有納米孿晶輔助的結構上穩定的銅結構的IC 封裝 |
|---|---|
| Original language | English |
| Publication status | Accepted/In press/Filed - 17 Dec 2024 |
Ic Package With Nanotwinning-Assisted Structurally Stable Copper Structure
Shien Ping FENG (Inventor), Chih Chun CHUNG (Inventor), Sheng Jye CHERNG (Inventor), Kaiyu MU (Inventor)
Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)